The “tail” of a particle size distribution references the particles that are several standard deviations removed from the mean of the standard Gaussian distribution. Figure 1 demonstrates the ...

The semiconductor industry is constantly marching toward thinner films and complex geometries with smaller dimensions, as well as newer materials. The number of chemical mechanical planarization (CMP) ...

Chipmakers are relying on machine learning for electroplating and wafer cleaning at leading-edge process nodes, augmenting traditional fault detection/classification and statistical process control in ...

Chemical mechanical polishing (CMP) is a process of global planarization that leverages the synergetic effect of chemical reactions and mechanical abrasion to facilitate wafer polishing. CMP has ...